Re: Apple’s A17 Pro Chip: Critical Flaw Causes Dual Subsystem Failure & Forensic Log Loss
苹果A17 Pro芯片存在严重硬件缺陷：安全 enclave与触控屏共享I²C4总线导致系统级联故障。此设计缺陷可能引发设备功能失效及关键数据丢失问题。 2025-9-11 02:36:54 Author: seclists.org(查看原文) 阅读量:2 收藏
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From: Matthew Fernandez <matthew.fernandez () gmail com>
Date: Mon, 8 Sep 2025 17:22:37 -0700

On 9/4/25 20:57, Joseph Goydish II via Fulldisclosure wrote:

TITLE:
APPLE'S A17 PRO SILICON FLAW: SHARED I²C4 BUS BETWEEN SECURE ENCLAVE AND DIGITIZER CAUSES CASCADING SYSTEM FAILURE

…
CONCLUSION:
This is a HIGH-SEVERITY HARDWARE DESIGN FLAW…
Can you elaborate on why you consider this high severity? From the description, it sounds as if this behaviour is fail-closed. That is, the effects are limited to DoS, with security properties preserved. 
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文章来源: https://seclists.org/fulldisclosure/2025/Sep/37
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